Heterogeneous Surface Polishing for PCB and IC Board

Heterogeneous Surface Polishing for PCB and IC Board

IC board could be divided into ABF BT and C2iM by the materials and process. C2iM is based on epoxy resin as the main sealing film material, and with the copper wires which are electroplated to build on each molding layer (the figure shown as below). Therefore, the grinding wheel will simultaneously grind both epoxy resin and copper wires in the grinding process.

Anchor provides two solutions of Vitrified GC finishing wheel and CBS wheel, according to the copper content of work piece and roughness requirement.

 

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